Key Applications

• Enterprise Server
• Application and data serving
• Model analysis
• Compute Intensive Applications
• Office environment

Key Features

1. Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s
2. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz ;- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
3. • 4 PCIe 4.0 x16 Full Height (FH);
   • 2 PCIe 4.0 x8  Full Height (FH)
4. Dual  10GBase-T LAN with Intel® X550 Ethernet Controller
5. Three 80mm high-performance 9.4K RPM Hot-swappable Middle Cooling Fans;Two 80mm 9.4K RPM Rear Exhaust Fans;1 air shroud
6. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc, Whisper-Quiet
7. 1 rear VGA, 1 Type A port, 1 COM Port (rear) and 6 USB ports (2 front USB 3.0 and 4 rear USB 3.0)

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