Key Applications

• Virtualization
• Enterprise Server
• Data Center Optimized
• Application and data serving
• Model analysis
• Compute Intensive Applications

Key Features

1. Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s
2. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz ;- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
3. • 4 PCIe 4.0 x16 Low Profile (LP);
   • 2 PCIe 4.0 x8 Low Profile (LP)
4. Dual Gigabit LAN with Intel® i350 Ethernet Controller
5. 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control;1 air shroud
6. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
7. 1 rear VGA, 1 Type A port, 2 COM Ports (1 front; 1 rear) and 6 USB ports (2 front USB 2.0 and 4 rear USB 3.0)

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