Key Features

1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
   Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
2. Intel® C621
3. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
   Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
4. 1 PCIe 3.0 x16 (HBA Add-On-Module),
   1 PCIe 3.0 x16 Left Riser Slot,
   1 PCIe 3.0 x24 Right Riser Slot,
   1 PCIe 3.0 x16 (Low Profile)
   M.2 Interface: 1 PCIe 3.0 x4 and 1 PCIe 3.0 x1
   M.2 Form Factor: 2280
   M.2 Key: M-Key
   U.2 Interface: 2 PCIe 3.0 x4,
   2 PCIe 3.0 NVMe x4 Internal Port(s)
   
   
   
5. Intel® C621 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10
6. 1 VGA port