Key Features

1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
   Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
2. Intel® C622
3. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
   Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
4. 1 PCIe 3.0 x32 Left Riser Slot,
   1 PCIe 3.0 x16 Right Riser Slot,
   1 PCIe 3.0 x16 for Add-On-Module (AOM)
   M.2 Interface: PCIe 3.0 x4
   M.2 Form Factor: 2242, 2260, 2280, 22110
   M.2 Key: M-Key
   U.2 Interface: PCIe 3.0 x4,
   4 PCIe 3.0 NVMe x4 Internal Port(s)
   
   
   
5. Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
6. Dual LAN with 10Gbase-T
   from C622
7. 1 VGA port

Optimized Servers